1.板材Plate:AL 5052、3003、1060 2.厚度Thickness:1.0-3.0MM 3.铜箔厚度Copper:1OZ～2OZ 4.阻焊Solder mask:感光油墨，耐高温，耐黄变 bright ink, heat resistant, yellowing resistance 5.表面工艺Surface Finish：OSP，HASL，Lead-free HASL 6.外型Shaping：CNC/V-CUT、模冲punching 7.电气性能Electrical Performance：100% AOI testing
